Skylake, the follow-up to Intel’s Broadwell was recently introduced during the Intel Developer Forum (IDF). The announcement was part of Intel’s plan to further explore computing and integrate the concept to make it faster and more convenient to customers. The product was introduced by Brian Krzanich, Intel’s CEO and Kirk Skaugen, the GM for Intel’s PC Client Computing Group. Skaugen described the product stating that customers can “expect a significant increase in performance, in battery life, in power efficiency, all on this new product.”

During the presentation, Intel showed a reference system equipped with an early version of the chip which runs in a 3Dmark. Afterwards, the chip maker demonstrated a 2-in-1 running a game, which is considered to be the software development vehicle through the use of Skylake together with Intel’s Irish Graphics. One of the features that was highlighted in the presentation was the “no wires” feature for Skylake.

As a demonstration, Skaugen presented a bunch of wires (chargers, connectors, etc.) that he personally carries for his gadgets whenever he travels. According to Skaugen, one of the main goals of Skyfall is to get rid of these wires over time by going “wireless”. It would be achieved through the introduction of new and innovate features. One of which is the Wireless Display (Wi-Di), the company’s version of the Miracrast technology that enables the transfer of video signals without the use of any cable. Intel is currently working on inexpensive adapters for TVs, capability building for smart TVs, Pro version for IT projectors, and added security features.

Aside from that, Skyfall is also working on WiGig, a type of wireless standard for docking that is said to be 10 times more efficient than the use of Wi-Fi. In the presentation, Skaugen showed that by putting it near a dock, it can connect to an external monitor. Skaugen added that there are plans to integrate this feature to Core M and Core M vPro systems by the first quarter of next year.

As reported, Skylake is the follow-up for Broadwell (currently known as Core M). Both Broadwell and Skylake are produced on Intel’s 14nm process and would also include the next generation microarchitecture.

During the IDF, Intel also announced that Skylake would be available for customers by the second quarter of 2015.