Qualcomm has already established a niche presence in the domain of chipsets that are renowned in the mobile industry. However, Qualcomm is currently aiming to compete at par with chipset giants such as AMD and Intel through the development of a Snapdragon 1000 series designed specifically for PCs.
Qualcomm has unravelled a line-up of ‘Always-Connected PC’ that were equipped with the Snapdragon 835 processor and the Windows 10 in December last year. According to a report facilitated by WinFuture, the line-up of ‘Always-Connected PCs’ are all set for a launch in the later part of this year with modifications to accommodate the recently unveiled Snapdragon 850 chipset. The report further added that the Snapdragon 1000 chipset with the codename SDM1000 would be capable of facilitating processing power at par with an Intel U-series or Y-series chipset.
It is also essential to note that the TDP in case of the SDM1000 is approximately 12 W, thereby placing it among the ranks of Intel’s U and Y series chipsets characterized with ultra-low power. TDP (Thermal Design Power) could be defined as the maximum amount of heat which could be developed by a chip during real-world utilization. It is imperative to observe higher capability of a processor in case of higher TDP.
However, the concerns for the matching of SDM1000 with Intel CPUs regarding bandwidth, raw performance and flexibility are profound despite the near similarities in TDP. On the contrary, the architecture of SDM1000 could be considered highly efficient as compared to that of Intel’s chips by providing almost twice or thrice the battery life. Therefore, there are no concerns for the tradeoffs as long as the SDM1000 is suitable for regular use.
The report also informed about the Snapdragon 1000 developer platform having two 128 GB UFS 2.1-rated memory modules and 16GB of LPDDR4X RAM on board. The SDM1000 would also include the Snapdragon 850 software modem, support for Gigabit WLAN and a new power management chip intended for management of increased power utilization.
According to the report, the Snapdragon 1000 is designed as a ‘socketed’ chip that implies SoC would not be soldered on the motherboard thereby suggesting the swapping out of the chip. The dimensions of the SDM1000 are found out to be 20 x 15 mm which is higher than that of the Snapdragon 850 but smaller than the average Intel processor that measures 45 x 24 mm regarding dimensions.